SAW Grade Lithium Tantalate Wafers

Lithium Tantalate (LiTaO3) crystals and substrates are highly valued for their exceptional surface wave applications, making them indispensable in various industries. With its perovskite M6 crystal structure, LiTaO3 exhibits a unique combination of optical, piezoelectric, and pyroelectric properties, rendering it ideal for surface wave technology.

Hangzhou Freqcontrol Electronic Technology (CQT Group) specializes in providing LiTaO3 substrates ranging from 3 inches to 6 inches in diameter. These substrates are meticulously engineered to meet the stringent requirements of surface wave applications. Additionally, we offer black LiTaO3 wafers, enhancing their functionality and performance in specific applications.

LiTaO3 substrates are available in various cut angles optimized for surface wave propagation. Commonly utilized cut types include 36°Y, 42°Y, and X-112°Y-cut, each offering distinct surface wave propagation characteristics tailored to different application needs. These substrates exhibit remarkable electromechanical coupling coefficients and low acoustic attenuation, ensuring efficient surface wave transmission.

The introduction of black LiTaO3 wafers further enhances their utility by significantly reducing the pyroelectric effect while maintaining their piezoelectric properties. This unique feature allows blackened LT wafers to neutralize electrical charges instantaneously, making them ideal for applications requiring rapid response and precise control.

With CQT Group's comprehensive range of LiTaO3 substrates and blackened LT wafers, customers can expect superior performance and reliability in their surface wave applications, catering to diverse industry needs.

SAW Grade Lithium Tantalate Wafer Features and Applications

Lithium tantalate (LiTaO3) is a piezoelectric single-crystal material valued for its electromechanical coupling characteristics and low acoustic attenuation. These properties make SAW grade lithium tantalate substrates suitable for surface acoustic wave devices, including RF filters and resonators used in frequency-control and signal-processing applications.

For device manufacturers, substrate selection should account for the required acoustic-wave propagation direction, crystal orientation, wafer thickness, surface condition, and flatness. Matching these parameters to the device design helps establish suitable substrate specifications before production.

• Multiple crystal cuts: X, Y, Z, X-112Y, Y36, Y42, Y48, and other available orientations.

• Multiple wafer diameters: 3-inch, 4-inch, and 6-inch substrates.

• Flexible thickness options: 0.18–0.5 mm or greater, depending on the required specification.

• Surface finish options: Single-side polished (SSP) or double-side polished (DSP).

• White and black wafers: Black lithium tantalate is available for applications requiring reduced pyroelectric response. See our black lithium tantalate wafers for more details.

For device-level reference, explore our SAW resonator products to understand the related frequency-control applications.

Available Sizes, Crystal Orientations, and Surface Options

Our SAW grade LiTaO3 wafers are available in 3-inch, 4-inch, and 6-inch diameters. Common crystal cuts include X, Y, Z, X-112Y, Y36, Y42, and Y48, with additional orientations available for specification confirmation.

Wafer thickness starts from 0.18 mm, with 0.18–0.5 mm and thicker options indicated in our product specifications. Primary flat dimensions include 22 mm, 32 mm, 42.5 mm, and 57.5 mm. Orientation flats are available, while back-side finish and edge configuration can be specified according to the application.

Manufacturing and Quality Control

Consistent substrate quality depends on crystal processing, dimensional control, surface preparation, and inspection. CQT's published LN/LT wafer process flow covers crystal growth and ingot quality checks, X-ray and angle testing, lapping, etching, surface grinding, polishing, cleaning, roughness measurement, flatness measurement, and inspection reporting.

These process stages provide buyers with a clearer view of the manufacturing and inspection work behind the finished substrate. 

Hangzhou Freqcontrol Electronic Technology Ltd. has experience in piezoelectric crystal and substrate manufacturing for microelectronics and frequency-control applications. Learn more about our company background and manufacturing capabilities.

What to Confirm Before Ordering SAW Grade LiTaO3 Wafers

To help us evaluate your requirements and provide a more accurate quotation, please share the following information where available:

• Wafer diameter and required quantity

• Crystal cut, orientation, and orientation flat requirements

• Target thickness and dimensional tolerances

• Single-side or double-side polishing requirements

• Required LTV, TTV, bow, warp, and surface roughness limits

• White or black LiTaO3 material selection

• Packaging requirements and intended SAW device application

If your project has a drawing, technical specification, or existing substrate reference, please include it with your inquiry. Our team can review the requested parameters and confirm the applicable specifications before order placement.

Frequently Asked Questions

What wafer diameters are available?

Our SAW grade lithium tantalate wafers are available in 3-inch, 4-inch, and 6-inch diameters.

Which crystal orientations can be supplied?

Available orientations include X, Y, Z, X-112Y, Y36, Y42, Y48, and other options subject to specification confirmation.

What thicknesses are available for SAW grade LiTaO3 wafers?

The published specification lists 0.18–0.5 mm or greater. Please provide your target thickness and tolerance so that the required configuration can be confirmed.

Are black lithium tantalate wafers available?

Yes. Black LiTaO3 wafers are available for applications requiring reduced pyroelectric response. Refer to our black lithium tantalate product page for further information.

Can I request single-side or double-side polishing?

Yes. Both single-side polished (SSP) and double-side polished (DSP) surfaces are listed as available options. Confirm the required surface finish when requesting a quotation.

What information is needed for a quotation?

Please provide the wafer diameter, crystal orientation, thickness, surface finish, quantity, and any critical flatness or surface requirements. Drawings or technical specifications are helpful when available.