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    Lithium Niobate on Insulator Substrates LNOI

    Lithium Niobate on Insulator Substrates LNOI

    Lithium Niobate Thin Films on Insulator is kind of POI (Piezoelectric on Insulator) wafer. It's stacked sequence structure is made of support substrates that can be silicon, quartz, fused silica, sapphire or LN wafer, the interlayer is thermal oxide SiO2 that works as insulator

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    Lithium Niobate Thin Films on Insulator is kind of POI (Piezoelectric on Insulator) wafer. It’s stacked sequence structure is made of support substrates that can be silicon, quartz, fused silica, sapphire or LN wafer, the interlayer is thermal oxide SiO2 that works as insulator and lithium niobate film is the functional layer above the insulation layer.

    POI /LNOI engineered substrates enable the design of filters with high quality factor, large bandwidth, very low temperature sensitivity and low insertion loss with a simple device manufacturing technology. These wafers are developed and used for high-speed modulators, high Q factor SAW devices, IR-detectors, THz devices.

    We work with our strategical partner who has experienced at technology of smart cut and wafer bonding and supply with important Piezoelectric layer on LN/LT from the sizes of 3” 4” 6” up to 8” to build the special wafer with multilayered structure.


    Key Advantages of LNOI Thin Film Wafers

    LNOI substrates provide multiple technical benefits that make them ideal for advanced electronic and photonic devices.

    1. High Quality Factor (Q Factor)

    Devices fabricated on LNOI wafers demonstrate exceptionally high Q factors, which improves signal stability and performance in RF filters and resonators.

    2. Large Bandwidth Performance

    The optimized thin-film structure supports high-frequency operation, making LNOI suitable for modern wireless communication technologies such as:

    5G

    RF front-end modules

    Advanced telecom systems

    3. Low Insertion Loss

    Low signal attenuation ensures efficient signal transmission in optical and RF devices, improving overall device performance.

    4. Excellent Temperature Stability

    LNOI wafers provide low temperature sensitivity, which is critical for high-precision optical and sensing applications.

    5. Simplified Device Fabrication

    Compared with traditional bulk materials, LNOI enables:

    Smaller device footprints

    Higher integration density

    CMOS-compatible fabrication processes

    This helps reduce manufacturing complexity and production costs.



    Specifications For LNOI 

    Layers

    Parameters

    Specifications

    Top Functional Layer

    Material

    Lithium Niobate    Lithium Tantanlate

    Diameter

    3"

    4"

    6"

    8"

    Surface orientation

    X-cut or per request

    Primary flat oritentation


    per request


    deg(°)

    Secondary flat orientation


    per request



    Film Thickness average thickness


    300-600


    nm

    Front side /face roughness

    Optical polished

    Isolation Layer

    Buried Oxide avg thickness

    4600

    4700

    4800

    nm

    Buried Oxide thickness uniformity

    -5

    0

    5

    %

    Support substrate

    Material

    SI/LN/SAPPHIRE/QUARTZ/ETC

    Diameter

    3"

    4"

    6"

    8"

    Support layer total thickness

    525

    525

    625

    725

    Device growth method

    CZ

    CZ

    ZVD

    hydrothermal

    Device orientation

    {100}


    0.5

    deg(°)

    Device doping type

    N

    N



    Device dopant


    Phos



    Surface finish



    10

    nm



    Manufacturing Technology Behind LNOI Substrates

    The production of LNOI wafers relies on advanced semiconductor fabrication technologies:

    Smart-Cut Technology

    This process allows the transfer of ultra-thin lithium niobate layers onto insulating substrates with high uniformity and precision.

    Wafer Bonding

    Wafer bonding techniques create strong, defect-free interfaces between layers, ensuring reliability and performance.

    High-Precision Layer Control

    The thickness of the lithium niobate thin film and oxide layer can be controlled at nanometer levels, which is essential for photonic device performance.

    These processes result in highly reliable engineered wafers suitable for large-scale manufacturing.


    Main Applications of LNOI Lithium Niobate Wafers

    LNOI technology is enabling breakthroughs across multiple high-tech industries.

    High-Speed Optical Modulators

    LNOI is widely used in optical communication systems due to its strong electro-optic effect, enabling:

    Ultra-fast data transmission

    Low power consumption

    Compact photonic integrated circuits

    SAW (Surface Acoustic Wave) Devices

    High Q-factor SAW devices manufactured on LNOI wafers are used in:

    RF filters

    Wireless communication equipment

    Signal processing systems

    Infrared (IR) Detectors

    LNOI materials support advanced sensing systems, including:

    Infrared imaging

    Environmental monitoring

    Industrial detection systems

    THz Devices

    Terahertz technologies are emerging in fields such as:

    Security screening

    Medical imaging

    High-speed wireless communication

    LNOI substrates play a key role in enabling these next-generation devices.

    Integrated Photonics

    Many photonic integrated circuits rely on LNOI wafers for:

    Optical switching

    Laser systems

    Quantum photonics


    Why LNOI Is Becoming Essential in Next-Generation Electronics

    The demand for faster communication, smaller devices, and higher integration density is pushing semiconductor materials beyond traditional solutions. LNOI wafers provide a unique combination of:

    Electro-optic performance

    Piezoelectric properties

    Integration capability

    Scalable manufacturing

    As a result, LNOI is rapidly becoming a preferred platform for advanced RF, photonics, and sensing technologies.

    Reliable Supply of High-Quality LNOI Wafers

    Through collaboration with experienced technology partners specializing in smart-cut and wafer bonding, high-quality piezoelectric layers on LN/LT can be produced with stable performance and excellent wafer consistency.

    Available solutions include:

    Multilayer engineered POI wafers

    Custom substrate selections

    Precision thin-film lithium niobate layers

    Flexible wafer size options from 3″ to 8″

    These capabilities support both research institutions and large-scale semiconductor manufacturing.


    Lithium Niobate on Insulator Substrates LNOI

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