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Our Products List   » Piezo electronic LiTaO3 wafer , Quartz Wafer and LiNbO3 Wafer » SAW Filters / resonators for Wireless Lan , Low Power System , Cordless Telephone ,and Cellular Telephone » Silicon substrates 3",4" 5" and 6" lapped /polished by ASTM Control » Saw filters for Multimedia	· Silicon substrates 3",4" 5" and 6" lapped /polished by ASTM Control 150mm Polished Silicon Wafer   » Download PDF File General Process Material Properties ITEMS Characteristic ASTM Test Method Type/Dopant P, Boron N, Phosphorous N, Antimony F42 Orientations <100>, <111> F26 Resistivity ranges F84 - P, Boron 0.001 - 50 ohm cm - N, Phosphorous 0.1 - 40 ohm cm - N, Antimony 0.005 - 0.025 ohm cm - N, Arsenic < 0.005 ohm cm Oxygen Content 10-18ppma SEMI-STD or Custom Carbon Content 0.5-1.0 ppma SEMI-STD or Custom F1391 Mechanical and Surface Properties Parameter Prime Monitor/ Test A Test B ASTM Method Diameter 150+/-0.5mm 150+/-0.5mm 150+/-0.5mm F613 Thickness (祄) 500+/-13um 500+/-13um 500+/-13um F533 TTV (祄) < 6um < 8um < 15um F657 Bow (祄) < 30um < 40um < 60um F657 Wrap (祄) < 30um < 40um < 60um F657 Contamination, Particles @ >0.3 祄 <= 10 <= 30 <= 30 F523 Primary/Secondary Flat SEMI-STD or Custom F671
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