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1 This specification is used for 3” quartz wafer (SAW grade).
2 Growth method for quartz is to be hydro-thermal autoclave. All quartz stones are to be single crystal, no twinning allowed.
3 General Quartz Wafer Requirements
3.1 Wafer Diameter -- 76.2 ± 0.5 mm.
3.2 “Q” Factor -- 1.8 million minimum.
3.3 Thickness -- 0.55 ± 0.05 mm, 0.45 ± 0.05 mm, or other size if specified.
3.4 Bow -- < 30 microns (see Figure #3).
3.5 Taper -- < 0.025 mm (see Figure #4).
3.6 Seed -- The seed width must be not great than 3 mm. The location is not currently specified, but preferably to be within the center 6.5 mm of the wafer.
3.7 Wafer Orientation -- To be as requested ± 0.25 degrees ( ± 15 minutes), unless specified .
3.8 Tilt Out of X-Axis -- The wafer plane is to be < 0.25 degrees (15 minutes) of the X-axis.
3.9 Identification flat position and length is to be as follows:
3.9.1 Primary Flat Location -- Must be within ± 0.10 degrees ( ± 6 minutes) perpendicular to the X-axis, unless specified .
3.9.2 Primary Flat Length -- From 20 to 24 mm, unless specified.
3.9.3 Secondary Flat Location(s) -- Must be within ± 2.5 degrees, as illustrated in Figure #2.
3.9.4 Secondary Flat Length -- From 8 to 12 mm.
3.10 Surface Polish Quality
3.10.1 Cleanliness -- SAW grade mirror polish. No stains or residues on either side when inspected
3.10.2 Front surface must be free of scratches, pits(excluding seed line), dimples, cracks, “orange peel”, smudges, fingerprints, saw marks, and unpolished areas. Typically referred to as “mirror polish”.
3.10.3 Backside Polish -- Lapped with GC1100# (W14) diamond.
3.10.4 Edge Chips -- Not to exceed 0.75 mm .
3.10.5 Edge Bevel -- To extend inward from the wafer edge 0.5 to 1.5 mm, with a bevel angle of 5 0 to 15 0 (see Figure #1).
•  Individual Wafer Orientation “Special” Requirements

4.1 29 0 Y Quartz
4.1.1 Secondary Flat -- None. This angle has two primary flats, both perpendicular to the X-axis, 180 0 apart.
4.2 30 0 Y Quartz
4.2.1 Secondary Flat -- one flat, 157.5 0 clockwise from the primary flat.
4.3 31 0 Y Quartz
4.3.1 Orientation -- 31 0 ± 0.1 0
4.3.2 Secondary Flats -- Two flats, 180 0 and 225 0 clockwise from the primary flat.
4.4 32 0 Y Quartz
4.4.1 Secondary Flat -- One flat, 180 0 from the primary flat.
4.5 33 0 Y Quartz
4.5.1 Secondary Flats -- Two flats, 135 0 and 225 0 clockwise from the primary flat.
4.6 34 0 Y Quartz
4.6.1 Secondary Flat -- One flat, 90 0 clockwise from the primary flat.
4.7 35 0 Y Quartz
4.7.1 Secondary Flat -- One flat, 45 0 counter-clockwise from the primary flat.
4.8 36 0 Y Quartz
4.8.1 Secondary Flats -- Two flats, 90 0 and 270 0 from the primary flat
4.9 37 0 Y Quartz
4.9.1 Secondary Flat -- Two flats, ± 45 0 from the primary flat.
4.10 38 0 Y Quartz
4.10.1 Secondary Flat -- One flat, 135 0 clockwise from the primary flat.
4.11 40 0 Y Quartz
4.11.1 Secondary Flats -- Two flats, 45 0 and 90 0 clockwise from the primary flat.
4.12 42 0 Y (“ST”) Quartz
4.12.1 Orientation -- 42.75 0 ± 0.5 0
•  Secondary Flat -- None specified.

5 Package
5.1 Wafers are packaged in plastic containers (25 wafers each) which are individually sealed in plastic bags, and are boxed in cardboard with 8 or less containers. Any empty space shall be filled with packing peanuts and foams.
5.2 Wafer supplier must maintain the records by lot number for material shipped to customer to this specification. The records must include all QC data for measurable parameters of the samples inspected. The records are to be available to customer for a period of one year from date of shipment of the product.
5.3 Each package of 25 wafers must be marked with information required by purchasing and receiving: Wafer's name, wafer orientation, wafer diameter, lot number, inspector's number and date. Each outer box must be marked which side is up, do not stack, fragile, and have two shock watch label attached to opposite sides, and also be labeled with the following:
5.3.1 Supplier name and address
5.3.2 Lot number
5.3.2 Customer's name and address
5.3.3 Customer's part number, if required
5.3.4 Date boxed

Figure 5# Top surface flatness is the maximum height difference between any two points on the wafer surface. The wafer may be in a vacuum state. If A ＞ B then surface flatness =A