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Our Products List |
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·Optical Materials for The Fiber Optics and Telecommunication Industries |
Lithium Niobate Substrate
wafer parameter
Polished as |
Better than 20/10 |
Flatness |
¦Ë ~¦Ë/8 (depends on wafer size) |
Wavefront deformation |
¦Ë/4~¦Ë/8 (depends on wafer size) |
Size tolerance |
¡À0.02mm |
TTV |
¡À0.01mm |
3¡± X-Cut Lithium Niobate optical wave guide
wafer |
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| The Specification of 3¡± X-cut LN wafer |
Orientations Variation: ¡À0.5¡ã
Wafer Flat:
Primary Flat: Perpendicular to the +Z Axis¡À0.5¡ã
Secondary Flat: 135¡ã Clockwise from the primary flat when viewing the -X polished face
Surfaces:
-X: Polished. No pits or scratches allowed within the working area (entire wafer diameter less 1.0mm around the edge). Inspected using unaided eye with reflected light.
+X: Polished. Light pits and scratches allowed within the working area (entire wafer diameter less 1.0mm around the edge). Inspected using unaided eye with reflective light.
Edge: All edges rounded with a
0.70¡À0.2 radius.
Flatness: Warp equal to or less
than 0.05mm. Measured in the free state.
Total Thickness Variation (TTV):
Less than 0.01mm. Measured in the clamped state.
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3" Z-Cut Lithium Niobate
optical wave guide wafer
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| The Specification of 3¡± Z-cut LN Wafer |
Orientations Variation: ¡À0.5¡ã.
Wafer Flat:
Primary Flat: Perpendicular to the -Y axis¡À0.5¡ã
Secondary Flat: 90¡ã counter-clockwise from the primary flat when viewing the -Z polished face.
Surfaces:
-Z: Polished. No pits or scratches allowed within the working area (entire wafer diameter less 1.0mm around the edge). Inspected using unaided eye with reflected light.
+Z: Polished. Light pits and scratches allowed within the working area (entire wafer diameter less 1.0mm around the edge). Inspected using unaided eye with reflected light.
Edge: All edges rounded with a
0.70¡À0.2 radius.
Flatness: Warp equal to or less
than 0.05mm. Measured in the free state.
Total Thickness Variation (TTV):
Less than 0.01mm. Measured in the clamped state
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